
Highlights from CES 2026: XMOS Unveils Next-Generation DSP
At the 2026 International Consumer Electronics Show (CES 2026), XMOS, a company specializing in Generative System-on-Chip (GenSoC) and edge AI technologies, showcased an impressive array of innovations in collaboration with its extensive ecosystem partners, all centered around the theme of “intelligence.” During the event, numerous customer terminal products developed on XMOS’s next-generation audio DSP, embedded vision, and robotics platforms were prominently featured. These products spanned categories such as smart audio, voice interaction, and robotics, demonstrating how XMOS technology empowers devices with the capabilities of Generative AI and edge computing, facilitating the transition of innovative products from concept to market.
Key Features from XMOS at CES 2026
GenSoC: The Future of Hardware Programmability
One of the most talked-about topics of the week was the introduction of the Generative System-on-Chip (GenSoC). This innovative chip allows users to describe system behavior using natural language while ensuring real-time timing accuracy and functional performance. Leveraging XMOS’s expertise in parallel processing and deterministic technology, GenSoC provides enhanced intelligence and capabilities for edge devices. It offers a new platform where custom hardware design becomes as efficient and intuitive as software development, marking the dawn of generative hardware design.
DSP-Tuned GUI: Faster Iteration and Better Sound
We also demonstrated a workflow for tuning the graphical user interface (GUI) using our digital signal processor (DSP). This allows users to conveniently iterate in real-time on audio processing chains, fine-tuning sound quality, and adjusting design plans based on specific acoustic characteristics. Explore how XCORE for DSP can empower your next product development.
Embedded Vision AI: Advancing Edge Intelligence Beyond Audio
XMOS’s technology extends beyond audio. At the event, we showcased edge AI vision technology, highlighting how deterministic real-time processing and efficient computing power support smarter embedded systems.
Software-Defined DAC: Flexible Audio Processing
Software-defined audio emerged as a core theme throughout the event. We demonstrated a software-defined digital-to-analog converter (DAC), vividly illustrating XMOS’s technological path: creating feature-rich audio systems through software to reduce hardware complexity while enabling rapid iteration and upgrades based on changing needs.
Noteworthy Innovations from XMOS Customers
A significant allure of CES is witnessing cutting-edge technology transformed into tangible commercial products. This year, XMOS proudly shared several customer innovations:
Reachy Mini Robot Featuring XMOS Technology
In the keynote speech by NVIDIA CEO Jensen Huang, the Reachy Mini robot was showcased, highlighting our excitement. This collaborative effort by Pollen Robotics, Seeed Studio, and Hugging Face features the XMOS VocalFusion® XVF3800 chip, providing the robot with stable voice capture and interaction capabilities, resulting in an engaging and delightful robot interaction experience.
Fosi Audio DAC with “XMOS POWERED” Features
Fosi Audio emphasized the “XMOS POWERED” label on their new portable DAC, the DS3. This designation represents a high-performance feature set specifically designed for the high-fidelity (Hi-Fi) audio market, integrating advanced signal processing, intelligent energy management, and top-notch audio quality to deliver “bit-perfect” audio output for a pure listening experience.
LARK 1.0 Pro Wireless Microphone with XMOS DSP Technology
The LARK 1.0 Pro, developed by S-TRACK for teaching and recording scenarios, utilizes 2.4G wireless transmission technology and a highly optimized real-time DSP pipeline to provide reliable, high-definition audio experiences in classrooms and lecture halls. The core of its processing pipeline is the XMOS XCORE.AI processor, which serves as the main controller and high-performance DSP.
2iC-Care’s Andi Hub Smart Health Terminal
XMOS also spotlighted the Andi Hub smart health terminal from 2iC-Care. This leading preventive care solution employs XMOS VocalFusion XVF voice processing technology to deliver high-definition, ultra-reliable, far-field bidirectional audio, supporting technology-enabled care. This serves as an exemplary case of how the XVF3800 chip empowers the next generation of telemedicine products.
Upcoming Opportunities to Connect with XMOS
If you missed the opportunity to engage with XMOS at CES, don’t worry! XMOS will be at the Embedded World 2026 from March 10 to 12, 2026, in Nuremberg. This will be an excellent chance for you to connect with the XMOS team, explore our latest technology demonstrations, and discuss your next product plans. Together, we can explore how to build smarter edge systems across various fields, from audio DSP and voice technology to embedded AI.
Original article by NenPower, If reposted, please credit the source: https://nenpower.com/blog/xmos-unveils-next-generation-dsp-and-innovative-products-at-ces-2026/
