Manz Technology has announced a strategic partnership with XTPL to develop ultra-fine dispensing equipment for the semiconductor industry. The announcement was made on February 24, 2026. The two companies aim to apply XTPL’s ultra-fine dispensing technology in the advanced packaging sector, providing customers with a comprehensive technical solution that spans from research and development to the integration of production equipment.
This collaboration not only enhances Manz Technology’s product portfolio but also strengthens its technological position in the global advanced packaging process market. XTPL has developed semiconductor ultra-fine dispensing equipment that allows for precise control over the deposition of functional nanomaterials, with line widths ranging from several tens of micrometers to less than 1 micrometer. This technology has already been validated for mass production in the display industry and is now being expanded into advanced semiconductor packaging processes.
As part of the collaboration, XTPL will establish a Delta Printing System at Manz Technology’s semiconductor innovation and R&D center in Taoyuan. This facility will serve as a localized platform for process development and validation. The R&D equipment will assist customers in adopting ultra-fine dispensing technology, offering a complete path for technology transfer and commercialization from R&D to production, effectively reducing the time to market for new technologies and enhancing R&D efficiency.
This partnership combines XTPL’s ultra-fine dispensing technology with Manz Technology’s expertise in semiconductor process equipment and system integration. Both companies will focus on collaborating with third-party clients to evaluate market potential applications, driving tangible business outcomes and creating flexible, efficient manufacturing solutions to meet diverse customer needs.
Lin Junsheng, General Manager of Manz Technology, stated that the company’s existing technology supports the precise deposition of both conductive and non-conductive materials, catering to the requirements of 2D and 2.5D architecture processes. The integration of XTPL’s ultra-fine dispensing technology will further extend capabilities into 3D architectural applications. This collaboration not only broadens Manz Technology’s product offerings but also solidifies its innovative position in the global advanced packaging equipment market.
Manz Technology aims to accelerate the market launch of next-generation packaging technologies in response to the demand for high density, high integration, and high reliability, creating more flexible and scalable manufacturing solutions to help clients minimize implementation risks and shorten the timeline from validation to mass production.
Filip Granek, CEO of XTPL, expressed enthusiasm about partnering with Manz Technology, which holds a key position in the Asian semiconductor industry. XTPL’s nanometer-level ultra-fine dispensing technology will be closely integrated with Manz’s advanced packaging processes, automation, and system integration solutions to jointly accelerate the deployment and scaling of innovative technologies in the advanced packaging market. This collaboration will drive ultra-fine dispensing technology to create substantial business opportunities and open new possibilities for the next generation of semiconductor processes.
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