iREX Shenzhen (2026) International Embodied Intelligence and Humanoid Robotics Exhibition

Event Date: November 26-28, 2026

Location: Shenzhen International Exhibition Center (Baoan)

The iREX 2026 Shenzhen International Embodied Intelligence and Humanoid Robotics Industry Chain Exhibition is set to be a comprehensive platform for the entire industry chain, unlocking new opportunities in the humanoid robotics sector. The intelligent robotics industry, identified as a core area in the 14th Five-Year Plan, is currently at a pivotal moment of transitioning from “technological accumulation” to “scale explosion.” This rise is a direct result of systematic policy support, significant technological breakthroughs, rigid market demands, and collaborative ecosystem development.

During the 14th Five-Year period (2026-2030), the intelligent robotics market is projected to reach a scale of 400 billion yuan, securing its position as the largest globally. This industry is poised to become a key engine for creating new productive forces and supporting the construction of a manufacturing powerhouse, heralding a new chapter of “AI empowering embodied intelligence and robots reshaping production and life.”

The Guangdong-Hong Kong-Macao Greater Bay Area has emerged as the largest hub for the intelligent robotics industry in China, leading the nation in both industrial scale and the number of enterprises. This competitive industrial ecosystem provides a solid foundation for the exhibition.

Leveraging the industrial advantages of the Greater Bay Area, the iREX 2026 Shenzhen International Exhibition will focus on “New Technologies, New Products, New Scenarios,” and is scheduled to commence on November 26-28, 2026, at the Shenzhen International Exhibition Center (Baoan). As an annual event for the bay area’s robotics industry, the exhibition will deeply connect upstream and downstream resources, accurately match industry application scenarios in Shenzhen and its surroundings, and create a core platform for global intelligent robotics enterprises to showcase technologies, convert achievements, and engage in collaboration.

In conjunction with the China High-Tech Achievements Fair, the event is expected to attract over 600 renowned companies from around the globe, gathering tens of thousands of professional buyers, industry experts, and practitioners. This will facilitate the industry’s transition from “concentrated development” to “global leadership.”

The holding of iREX 2026 will further integrate the industrial resources of the Greater Bay Area, reinforcing Shenzhen’s role as a central hub for applications and promoting the deep integration of robotics technology with the real economy.

The organizing committee encourages global robotics companies, upstream and downstream institutions, and industry practitioners to actively participate in this intelligent feast, share development opportunities, and envision a future of human-robot collaboration together.

Main Exhibition Categories:

Exhibitors will showcase a wide range of products, creating a one-stop professional exhibition and trade platform:

• Embodied Intelligent Systems
  • Humanoid Robots: Full-size general-purpose robots, industrial robots, home service/companion robots, medical and care robots, educational training robots, security/special operations robots, and open-source/developer versions of humanoid robots.
  • Various Embodied Intelligent Robots: Industrial collaborative robots, bipedal/quadrupedal bionic robots, composite mobile robots, dual-arm collaborative robots, medical rehabilitation exoskeletons, surgical robots, logistics robots, cleaning robots, educational robots, and catering service robots.
  • Special Purpose Robots: Bomb disposal/rescue robots, underwater/high-altitude/nuclear inspection robots, mining/agricultural engineering robots, and space operation robots designed for extreme environments.
  • Other Embodied Intelligent Carriers: Intelligent connected vehicles, industrial unmanned vehicles, industry-grade drones, and intelligent mobile operation platforms.
• Core Perception Systems
  • Visual Perception: 3D vision sensors, industrial cameras, LiDAR, millimeter-wave radar, depth cameras, and image recognition modules.
  • Computational/Tactile Perception: Six-dimensional torque sensors, force sensors, electronic skin, tactile arrays, and collision detection sensors.
  • Spatial and State Perception: Encoders, inertial modules, GPS/Beidou positioning modules, MEMS attitude sensors, ultrasonic sensors, and distance sensors.
  • Multimodal Interaction Perception: Voice recognition modules, biometric modules, emotional interaction sensors, and environmental temperature/humidity/gas detection sensors.
• Decision and Cognitive Systems
  • Computational Hardware: AI-specific chips (GPU/TPU/NPU/MCU), brain-like chips, automotive-grade chips, computational servers, edge computing devices, and AI accelerator cards.
  • Algorithms and Large Models: Multimodal large models, VLA (Vision-Language-Action) large models, autonomous decision-making algorithms, reinforcement learning algorithms, motion control algorithms, SLAM navigation algorithms, motion capture technologies, and multi-machine collaborative scheduling systems.
  • Software and Operating Systems: Robot-specific operating systems (ROS, open-source robot OS), simulation and digital twin systems, AI development toolchains, robot programming platforms, visual debugging systems, and data platforms.
• Execution and Transmission Systems
  • Drive Units: Hollow cup motors, frameless torque motors, servo motors, servo drivers, integrated drive control units, and linear/rotary actuators.
  • Transmission Components: Harmonic gear reducers, precision planetary gear reducers, planetary rolling screw mechanisms, ball screws, bearings, gearboxes, and joint modules.
  • End Effectors: Bionic dexterous hands, multifunctional end effectors, specialized working tools, flexible actuators, and pneumatic/hydraulic drive units.
• Energy and Thermal Management Systems
  • Energy Units: High energy density power batteries, solid-state lithium batteries, fast-charging battery packs, energy storage devices, and backup power modules.
  • Management and Support: Battery management systems (BMS), fast charging/replacement modules, wireless charging devices, and power protection circuits.
  • Thermal Management Systems: Liquid cooling/air cooling heat dissipation modules, phase change heat dissipation materials, temperature control systems, and lightweight heat dissipation structural components.
• Scenario-Based Solutions and Application Cases
  • Industrial Scenarios: Intelligent manufacturing production line upgrade solutions, 3C electronics assembly solutions, automotive manufacturing collaboration solutions, warehouse logistics sorting systems, and factory inspection and maintenance solutions.
  • Public Service Scenarios: Smart home management solutions, elderly care solutions, commercial welcoming and guiding systems, catering retail service solutions, and integrated cleaning and sanitation solutions.
  • Medical and Health Scenarios: Surgical robot clinical solutions, rehabilitation exoskeleton application solutions, smart hospital delivery systems, and solutions for assisting individuals with disabilities.
  • Special Industry Scenarios: Emergency rescue solutions, nuclear power/grid inspection solutions, mining safety operation systems, fire prevention and bomb disposal operation solutions, and underwater/high-altitude operation solutions.
  • Education and Cultural Innovation Scenarios: Robot training teaching platforms, youth science popularization solutions, entertaining bionic robots, and digital human + embodied intelligence integration solutions.
• Manufacturing Equipment and Supporting Materials
  • Manufacturing Equipment: Precision machining equipment, additive manufacturing (3D printing) equipment, precision assembly lines, robot testing and calibration equipment, and automated production line solutions.
  • Structural and Functional Materials: Lightweight alloys, carbon fiber composites, PEEK engineering plastics, self-lubricating materials, wear-resistant coatings, flexible electronic materials, and bionic materials.
  • Supporting Components: Connectors, wiring harnesses, precision gears, fasteners, pneumatic components, seals, and custom non-standard structural components.
• Cutting-Edge Technologies and Industrial Ecosystem Support
  • Cutting-Edge Technological Achievements: Brain-computer interface technology, flexible electronics technology, brain-like intelligent technology, digital twin technology, and human-robot collaboration technology.
  • Industrial Platforms and Institutions: Universities/research institutes, key laboratories, innovation centers, pilot bases, industrial parks, incubators, and industry associations and alliances.
  • Industrial Services: Computing power service platforms, cloud platforms, investment and financing institutions, intellectual property services, testing and certification agencies, and industry consulting and media services.

For booth reservations and more information, please contact:

Project Manager: Manager Yin

Mobile/WeChat: 18217255997

QQ: 2366454544

Email: 2366454544@qq.com

Official Website: www.semiz.cn