Highlights of the 2026 Munich Shanghai Electronics Show: Forum Overview and Industry Insights

The Munich Shanghai Electronics Show is set to take place from July 1-3, 2026, at the Shanghai New International Expo Center, covering nearly 120,000 square meters. The event plans to host over 1,800 high-quality exhibitors from both domestic and international markets, expecting to attract more than 70,000 professional visitors.

During the exhibition, several cutting-edge technology forums will be held, focusing on popular topics in sectors such as automotive electronics, medical electronics, data centers, embodied intelligence, consumer IoT, energy storage, smart factories, embedded systems, motor drives, new semiconductors, and connectors. Renowned experts, company representatives, and outstanding suppliers and technical service providers from the industry will come together to discuss hot topics, share insights, and explore industry trends, all aimed at driving continuous innovation and development in the electronics sector.

Here is an overview of the forums scheduled at the Munich Shanghai Electronics Show:

• Automotive Electronics: 2026 (4th) International Automotive Electronics Technology Innovation Forum
• Automotive Three Electric Systems: 2026 New Energy Vehicle Three Electric Key Technology Summit Forum
• Medical Electronics: International Medical Electronics Innovation Forum
• Data Center: Data Center Reconstruction and Edge Innovation Applications Forum in the AI Era
• Embodied Intelligence: Embodied Intelligence Industry Application Conference
• Consumer IoT: Smart Life – Innovative Future – Consumer IoT Technology Integration Forum
• Energy Storage: 2026 Innovative Energy Storage Technology Forum
• Industrial Connectors: Intelligent Connection and Collaborative Evolution: Next-Generation Flexible Technologies Empowering Smart Factories
• Embedded Systems: International Embedded Systems Innovation Forum
• Motor Drives: 2026 International Motor Drive Technology Forum
• New Semiconductors: New Semiconductor Devices and Power Innovation Forum
• Connectors: International Connector Innovation Forum

The Automotive Electronics Forum will cover key topics such as:

• Smart driving AI and autonomous driving
• Multi-sensor integration and multi-source information fusion
• ADAS and environment perception technology (visual cameras, LiDAR, millimeter-wave radar)
• Intelligent connected algorithms and computing power

The Automotive Three Electric Systems Forum will discuss:

• Power battery safety technology
• Electric drive system technology
• New energy vehicle thermal management technology
• 800V high-voltage system technology
• Integrated electric drive and control technology

For the Embedded Systems Forum, the agenda includes:

• Morning session: Embedded AI technologies and applications – Edge AI technology trends, RISC-V + AI, high-performance SoC chips, and machine vision applications
• Afternoon session: Industrial IoT technologies – Multi-axis motor drive and control, IoT agents, industrial Ethernet, and new wireless networks

In the Motor Drives Forum, the focus will be on:

• New trends in motor drive and control technology
• New algorithms for motor control
• Analog signal chains in motor drives
• Optimization solutions for motor control and drives

The New Semiconductors Forum will highlight:

• Third-generation power semiconductors and passive devices
• New energy conversion and electric vehicle drive technologies
• AI and data center power technologies

The Medical Electronics Forum will address:

• Current status and development trends in the medical electronics industry
• Medical robotics
• Medical AI
• Wearable medical electronics and health IoT

The Data Center Forum will discuss:

• How next-generation MCUs can drive industrial AI
• From single breakthroughs to cluster operations, NPU neural network algorithm optimization
• Power semiconductors: From traditional devices to energy efficiency revolutions
• From general storage to customized high-speed solutions
• From “wired connections” to “wireless interconnections” to support data centers

The Embodied Intelligence Conference will explore:

• Case studies of industry applications from leading enterprises
• Strategies for core components industry collaboration
• Building an open and evolving embodied intelligence ecosystem
• Connecting data collection, processing, and action execution

The Connector Innovation Forum will focus on:

• Research on connector applications in emerging industries such as new energy vehicles, renewable energy, high-end medical equipment, and industrial IoT
• Digital transformation and innovation in the connector industry
• New materials, processes, designs, and testing for connectors
• Intelligent and low-carbon production of connectors
• Showcasing regional industrial clusters and innovative achievements

Notable companies participating in past forums include Valeo, Dongfeng R&D, Hyundai, BYD, and Schneider Electric.

This overview serves to inform attendees of the exciting opportunities and discussions set for the Munich Shanghai Electronics Show in 2026, aimed at fostering innovation and collaboration across the electronics industry.