On April 29, Asahi Kasei Microdevices (AKM) and Silicon Austria Labs (SAL) successfully completed a joint proof of concept that integrates current sensors into power modules for automotive applications, such as traction inverters and DC-DC converters. This innovative technology enhances energy efficiency and enables a compact and lightweight design for high-current applications using next-generation SiC power devices.
The demand for compact and lightweight solutions with high-resolution current sensing is rapidly increasing to achieve more efficient electric vehicle (xEV) inverter systems. To meet this demand, AKM is developing a linear Hall IC, the EZ232L, designed for coreless current sensors. With its high resolution and precision, this technology significantly improves the efficiency of traction inverters that operate across a wide current range. Traction inverters are critical components that drive the electric motors in xEVs, acting as a bridge between the battery and the electric drive system. Specifically, they play a vital role in converting the battery’s DC power into AC power.
Accurate current sensing within a wide dynamic range is essential for ensuring smooth and efficient control under various driving conditions, whether at low speed, high speed, cruising, or accelerating. In collaboration with SAL, AKM has developed a power module that integrates current sensing capabilities, overcoming the limitations of traditional magnetic-core-based current sensing.
“Through this joint technology validation, we have established a new standard for current sensing technology in power modules. We are honored to combine AKM’s expertise with SAL’s research and development capabilities to achieve this innovative result. We look forward to power modules that integrate coreless current sensing technology, contributing to the creation of smaller and lighter xEV traction inverters,” said Toshinori Takatsuka, General Manager of AKM’s Current Sensor Business.
Thomas Langbauer, Head of the Power Electronics Department at SAL, added, “The design of this power module offers an integrated solution, incorporating the latest direct copper-bonded power semiconductors, gate drive circuits, and current sensing functionality. The module utilizes standard PCBs and off-the-shelf components, providing flexibility and cost advantages for small to medium production runs.”
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