2026 International Integrated Circuit Innovation Expo – Major Upgrade of Conference Forum Section to Empower High-Quality Industry Development

The 2026 International Integrated Circuit Innovation Expo is set to take place from September 9 to 11 at the Shenzhen International Convention and Exhibition Center (Baoan). The theme for this year’s event is “Cross-Border Integration & Full-Chain Collaboration: Building a Distinctive Chip Ecosystem”, aimed at creating a high-end communication platform that encompasses the entire integrated circuit industry chain.

This expo will further emphasize the role of the conference forum as an “idea engine”, leveraging various approaches such as data forecasting, trend analysis, and technical discussions to gather global industry insights. The goal is to promote deep cooperation among all stakeholders in the industry chain, academia, research, and application, injecting strong momentum into innovation breakthroughs within the integrated circuit sector.

Three Major Sections Constructing a Full-Chain Communication Matrix Addressing Core Industry Needs

This year’s forum section is directed towards precisely addressing industry pain points and leading technological directions. It will feature a core structure comprising a high-level industry conference, an industry collaborative innovation forum, and a cross-border application forum. Over 20 high-quality meetings and activities are planned, forming a comprehensive communication system covering technological breakthroughs, industry chain collaboration, and application scenarios.

The high-level industry conferences will include top summits, special forums, and innovation competitions that focus on cutting-edge industry topics. The opening ceremony and Innovation Summit will invite leading experts and heads of major enterprises to engage in peak dialogues on core topics such as AI empowerment, chip-cloud collaboration, and resilience in the semiconductor supply chain. A strategic signing ceremony will also take place to signal new collaborative opportunities in the industry.

In the special forums, the Global Integrated Circuit Industry Analyst Conference will bring together think tanks from 25 countries to forecast the semiconductor market cycle and capacity layout from 2026 to 2030. The inaugural China Integrated Circuit Innovation Investment Conference will connect leading venture capital firms to bridge the gap between industry and capital, uncovering investment opportunities in areas such as computing power chips and HBM. Additionally, the first China University Students AI Empowerment Innovation and Entrepreneurship Competition will leverage dual mentorship resources from universities and enterprises to attract quality project roadshows from across the nation, offering incubation support and job opportunities for outstanding projects.

Industry Collaborative Innovation Forum Focused on Core Segments of the Industry Chain

The forum will delve into crucial aspects of the industry chain, including semiconductor manufacturing, equipment, materials, and components, aiming to resolve pressing challenges. The Semiconductor Manufacturing Core Equipment and Components Development Forum will analyze the path to domestic production of core components for lithography, etching, and ion implantation equipment, as well as the requirements for technological iteration.

The Advanced Packaging and Testing Technology Forum will focus on 3.5D heterogeneous integration, discussing hybrid bonding and 2.5D interlayer design, and exploring the collaborative value of optical interconnections and low-loss materials, aiming to enhance data center performance. A session on Compound Semiconductor Technology Innovation and Power Electronics will examine the application adaptation of third-generation semiconductor materials such as silicon carbide and gallium nitride in new energy vehicles and 5G communications.

The Machine Vision and Intelligent Manufacturing Forum will explore innovative paths for integrating machine vision and automation equipment, promoting the upgrade of automation devices to high-end intelligence, thereby supporting the high-quality development of manufacturing and the semiconductor industry. The Smart Industrial Control Core Components Innovation Forum will focus on the innovation chain of core components related to automation, gathering industry leaders in servo, vision, sensing, control platforms, and AI edge computing to discuss how these components can be integrated to enhance smart manufacturing capabilities and industry resilience.

Cross-Border Application Forum Centered on Chip Design and Applications

This forum will concentrate on key application fields such as AI, consumer electronics, automotive, RISC-V, industrial applications, and smart terminals, establishing a bridge between chip technology and terminal demands. The China RISC-V Ecosystem Conference will elucidate the optimization paths of open-source architectures in low-power devices, fostering deep integration between the RISC-V ecosystem and industrial control and smart terminal applications. The 2026 Chip Computing Power Innovation Summit will collectively explore how to overcome computing power bottlenecks through architecture innovation, design process revolutions, and IP reuse strategies in the post-Moore era.

The 2026 Smart Terminal Chip Ecosystem Summit will focus on “End-Side AI Chip Forces”, aiming to bring together leading global chip designers, algorithm developers, terminal manufacturers, and key software partners to explore solutions to core issues such as architecture innovation, toolchain collaboration, standardization, and security trust. The AI Empowered Consumer Electronics Innovation Forum will focus on the latest trends in AI and consumer electronics integration, sharing practical chip technology cases in AI computing power, IoT, and storage.

The AI Security Innovation Applications and Industry Integration Conference will explore innovation directions in smart security, integrating chips, algorithms, products, and services, and seeking pathways for industry integration while addressing development challenges, helping the security industry progress towards intelligent, ecological, and autonomous high-quality development.

The Edge AI and Intelligent Control Technology Industry Forum will strengthen the foundation of edge computing with domestic chips, empowering machines with autonomous perception through storage-computing collaboration and algorithm optimization. This will promote the efficient execution of intelligent agents like robots, ultimately achieving large-scale deep application of edge intelligence in diverse industrial scenarios.

Showcasing Global Industry Heights and Unlocking Collaborative Value through Diverse Formats

This year’s conference forums will emphasize high-end, international, and professional characteristics, establishing a global semiconductor “thought hub”. Events such as the Advanced Packaging and Testing Technology Forum and the Advanced Materials Innovation Development Conference will introduce top overseas technical teams, with international attendees from 25 countries including South Korea, Japan, and the United States, facilitating global technology exchange.

The Global Integrated Circuit Industry Analyst Conference will convene high-end overseas think tanks and dozens of top analysts to forecast global semiconductor market trends from 2025 to 2030. Each forum will be hosted by authoritative institutions in their respective fields, focusing on pressing industrial issues such as advanced process breakthroughs and green supply chain construction, avoiding generic discussions.

This expo aims to enhance the diverse effectiveness of the conference forums, offering not only a “technical feast” but also an “industry event for resource integration and strategic consensus”. Whether you are a research team seeking technological breakthroughs, an investment institution planning a layout, or a corporate representative looking to expand markets, this event will provide insights into cutting-edge trends, connect with core partners, and uncover new business opportunities.

Join us from September 9 to 11, 2026, at the Shenzhen International Convention and Exhibition Center (Baoan) as we invite global integrated circuit professionals to participate in this “cross-border integration and full-chain collaboration” industry event, together building a distinctive chip ecosystem and painting a new blueprint for the industry!